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Schneider Electric To Speak at PACK EXPO Conference

WHO:  Lucian Fogoros, Product Manager at Schneider Electric, will present “Machine Performance, OEE and IIoT Connectivity Made Easy” at PACK EXPO International. His focus will be to educate how powerful OEE functionality can be quickly implemented without a rip and replace strategy of existing automation equipment  with HMI and industrial data management in the cloud. These solutions offer hardware agnostic connectivity, simplified integration and ready access to KPIs and reports. The IIoT can be leveraged for decision support, visibility and access to packaging data enabling smarter machines and continuous performance improvements.

WHAT:  PACK EXPO International is the world’s largest, most comprehensive processing and packaging trade show in 2016, with over 2,100 exhibitors, solutions for 40+ vertical markets and a comprehensive educational track that lasts for nearly four days

WHERE:  McCormick Place, 2301 S King Drive, Chicago, IL 60616

WHEN:  Wednesday, November 9, 2016, from 11:00 - 11:30 am, in the Innovation Stage

Download this announcement in PDF format.

About Schneider Electric 

Schneider Electric is leading the Digital Transformation of Energy Management and Automation in Homes, Buildings, Data Centers, Infrastructure and Industries.

With global presence in over 100 countries, Schneider is the undisputable leader in Power Management – Medium Voltage, Low Voltage and Secure Power, and in Automation Systems. We provide integrated efficiency solutions, combining energy, automation and software.

In our global Ecosystem, we collaborate with the largest Partner, Integrator and Developer Community on our Open Platform to deliver real-time control and operational efficiency.

We believe that great people and partners make Schneider a great company and that our commitment to Innovation, Diversity and Sustainability ensures that Life Is On everywhere, for everyone and at every moment.

www.schneider-electric.com

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